Innventure will be attending the ISIG Executive Summit USA 2026, the premier gathering of semiconductor industry executives focused on Scaling AI: Hardware Innovation, Compute Acceleration and Next-Gen Infrastructure. This executive-level summit brings together leaders from across the semiconductor ecosystem—from hyperscalers and chip designers to equipment manufacturers and venture investors—to address the most critical challenges in advanced packaging, AI infrastructure, and next-generation computing.

Are your technologies advancing the semiconductor industry? Whether you're working on advanced packaging solutions, novel materials for chip manufacturing, testing and metrology innovations, or breakthrough processes that enable next-generation semiconductor production, Innventure seeks innovations that can reshape the industry. We look beyond incremental improvements to identify technologies with the potential to address fundamental bottlenecks in semiconductor manufacturing and performance.

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