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DarkNX Enters Agreement with Accelsius to Deploy 300MW NeuCool®-Enabled AI Data Center Campus in Ontario
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DarkNX Enters Agreement with Accelsius to Deploy 300MW NeuCool®-Enabled AI Data Center Campus in Ontario

Category

Press Release

Company

Accelsius

Date

November 17, 2025

Press Contact

press@innventure.com

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AUSTIN, Texas--(BUSINESS WIRE)--Accelsius, the leader in two-phase, direct-to-chip liquid cooling for AI and high-performance computing, today announced that DarkNX, a global digital infrastructure company, has entered into an agreement to deploy Accelsius’ NeuCool® technology across a new 300MW AI data center campus in Ontario, Canada. The project is expected to be the largest two-phase, direct-to-chip deployment to date, signaling a major shift toward large-scale industry adoption of next-generation cooling.

The first phase includes two facilities at 65MW, with deployments scheduled for 2026 and 2027.

As part of its overall thermal strategy for the campus, DarkNX selected NeuCool® for chip-level cooling alongside high-efficiency chiller systems from Johnson Controls (JCI) for facility cooling. The combined use of two proven, best-of-breed solutions will enable DarkNX to simplify system design, unlock higher efficiency, and operate with significantly warmer facility water temperatures, improving sustainability and reducing operational cost.

“Our vision is to build the world’s most advanced AI data centers and to do that, we must build them responsibly and efficiently,” said Isaac Islam, CEO of DarkNX. “Our technology agnostic and efficiency-first approach is why Accelsius’ two-phase, direct-to-chip technology stood out for enabling significantly warmer facility water temperatures, which paired with high-efficiency chiller systems from Johnson Controls, gives us a step-change in performance, sustainability, and total cost of ownership. This is the future of AI data center design, and we’re proud to lead the way.”

The DarkNX deployment reflects a growing industry movement toward liquid cooling architectures that support the extreme densities of modern AI clusters. NeuCool® delivers high heat-removal capacity at the chip, using non-conductive refrigerants, enabling more free cooling hours, and improved energy efficiency.

“This milestone represents a defining moment for the evolution of liquid cooling,” said Josh Claman, CEO of Accelsius. “DarkNX’s 300MW commitment signals a clear shift toward large-scale adoption of two-phase, direct-to-chip cooling. We’re excited to support Isaac and the DarkNX team in demonstrating how next-generation cooling, applied at scale, sets a new standard for AI-era data centers.”

About Accelsius

Founded by Innventure, Inc. (NASDAQ:INV), Accelsius empowers data center and edge operators to achieve their business, financial and sustainability goals through advanced cooling solutions. The proprietary NeuCool platform provides best-in-class thermal efficiencies through a safe, two-phase liquid cooling system that scales from single racks to entire data centers. For more information, visit accelsius.com or follow us on LinkedIn.

About DarkNX

DarkNX builds for the future, designing next-generation data centres optimized for AI and high-density GPU workloads. Guided by their technology agnostic approach, their goal is to reduce the cost of compute, prioritizing sustainability, performance and cost-efficiency. For more information, visit darknx.com or follow us on LinkedIn.

Contacts

Treble
McKenzie Covell
accelsius@treblepr.com

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